发明名称 HEAT DISSIPATION DEVICE AND POWER MODULE
摘要 A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.
申请公布号 US2010172104(A1) 申请公布日期 2010.07.08
申请号 US20100684160 申请日期 2010.01.08
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 YOSHIDA TADAFUMI;TASHIRO HIROKI
分类号 H05K7/20;F28F7/00 主分类号 H05K7/20
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