| 摘要 |
PURPOSE: A method for manufacturing a light emitting diode package is provided to improve heat radiation characteristic and light emitting efficiency. CONSTITUTION: A heat conductive filler and a high polymer are filled in a mold and are formed. A plurality of cavities are formed in one side of a package body(110). An electrode(120) passes through the package body. A light emitting diode chip(140) is mounted on the lower part of the cavity formed in the package body. A light emitting diode chip and an electrode are electrically connected with a bonding unit(150). The light emitting diode and the bonding unit are sealed using the molding resin. |
