| 发明名称 |
Method for producing connection member |
| 摘要 |
A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.
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| 申请公布号 |
US7748110(B2) |
申请公布日期 |
2010.07.06 |
| 申请号 |
US20070826758 |
申请日期 |
2007.07.18 |
| 申请人 |
PANASONIC CORPORATION |
发明人 |
ASAHI TOSHIYUKI;KARASHIMA SEIJI;ICHIRYU TAKASHI;NAKATANI SEIICHI;NISHIYAMA TOUSAKU;HIRANO KOICHI;SHIBATA OSAMU;NAKAYAMA TAKESHI;SAITO YOSHIYUKI |
| 分类号 |
H05K3/36;H01R13/24;H05K1/00;H05K1/02;H05K1/14;H05K1/18;H05K3/20;H05K3/34;H05K3/40 |
主分类号 |
H05K3/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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