发明名称 |
Chip scale package structure with metal pads exposed from an encapsulant |
摘要 |
A chip scale package structure and a method for fabricating the same are disclosed. The method includes forming metal pads on a predetermined part of a carrier; mounting chips on the carrier, each of the chips having a plurality of conductive bumps soldered to the metal pads; forming an encapsulant on the carrier to encapsulate the chips and the conductive bumps; removing the carrier to expose the metal pads and even the metal pads with a surface of the encapsulant; forming on the encapsulant a plurality of first conductive traces electrically connected to the metal pads; applying a solder mask on the first conductive traces, and forming a plurality of openings on the solder mask to expose a predetermined part of the first conductive traces; forming a plurality of conductive elements on the predetermined part; and cutting the encapsulant to form a plurality of chip scale package structures.
|
申请公布号 |
US7750467(B2) |
申请公布日期 |
2010.07.06 |
申请号 |
US20070891134 |
申请日期 |
2007.08.08 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
PU HAN-PING;HUANG CHIEN-PING;HSIAO CHENG-HSU |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|