发明名称 SENSOR SECURING APPARATUS AND CAMERA MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor securing apparatus which can ensure a heat release function of an image sensor and can enhance an adhesive intensity of the image sensor for a frame. <P>SOLUTION: The sensor securing apparatus includes: the frame 19 having a sensor mount region 27; and an image sensor 18 secured to the frame so as to have a border with the sensor mount region. The frame has a first adhesive applying hole 31 and a plurality of second adhesive applying holes 32a, 32b, 32c, and 32d. The first adhesive applying hole opens in the sensor mount region and faces the center part of the image sensor. The second adhesive applying holes are smaller than the first adhesive applying hole, open in the sensor mount region and are arranged around the first adhesive applying hole. Adhesive 33 is filled in the first adhesive applying hole and the second adhesive applying holes. The adhesive secures the image sensor to the frame. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147700(A) 申请公布日期 2010.07.01
申请号 JP20080321378 申请日期 2008.12.17
申请人 TOSHIBA CORP 发明人 SAITO TETSUO
分类号 H04N5/225;H04N5/335;H04N5/374 主分类号 H04N5/225
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