| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device with high joint strength between a pad electrode and a wire bond or the pad electrode and a bump by suppressing the corrosion of the pad electrode. SOLUTION: The solid-state imaging device includes: a semiconductor substrate 2 with the pad electrode 3 made of an aluminum material arranged therein; an insulating film 4 which is deposited on the semiconductor substrate and where the upper region of the pad electrode 3 is opened by dry etching with fluorine series gas as etching gas; and a protective film 6 which is deposited on the upper layer of the insulating film 4, so as to cover the front surface of the pad electrode 3. The protective film 6 is fluorocarbon formed by depositing the etching gas in the dry etching. COPYRIGHT: (C)2010,JPO&INPIT |
