| 摘要 |
PURPOSE: A semiconductor chip, a method for manufacturing the semiconductor chip, and a stack package are provided to prevent the crack on the back side of a wafer by controlling the depth of a contact plug which is formed in a wafer. CONSTITUTION: A hydrogen impurity(111) is inserted into a wafer(110). A semiconductor device(120) is formed on the wafer. A metal is electrically connected to the semiconductor device. A contact plug(162) passes through an insulating layer which is formed on the wafer. A wiring layer(170) is electrically connected to the contact plug and the metal.
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