CONNECTOR ALIGNMENT USING ALIGNMENT BUMPS AND NOTCHES

摘要

Described herein are connector alignment techniques and components that use alignment bumps and notches to facilitate high-bandwidth scaling. The alignment bumps may be located, for example, on the Converged I/O (CIO) standard-A receptacle and plug housings, on a USB compliant receptacle/plug pair, on a HDMI interface. That is, the alignment techniques and components described here in may be used with virtually any optical interface. The features may be molded into the receptacle housing to become one piece.