| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a cutting means from contacting with an adherend when cutting an adhesive sheet stuck to the adherend. <P>SOLUTION: A sheet sticking device 10 includes: a table 11 for holding a ring frame RF and a semiconductor wafer W; a support means 12 for supporting an adhesive sheet S so as to allow it to face the upper face of the ring frame RF and the upper face of the semiconductor wafer W; a pressing roller 16 that presses the adhesive sheet S against the ring frame RF and the semiconductor wafer W so as to stick it to the ring frame and the semiconductor wafer; a cutting means 14 for cutting the adhesive sheet S; and a moving means 13 for moving the table 11 and the support means 12 relative to each other. The cutting means 14 is arranged along the wafer W via the adhesive sheet S so as to cut the adhesive sheet S into a prescribed shape by the movement of the cutting means 14 together with the wafer W relative to the adhesive sheet S. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
