| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate and a method of manufacturing the same which are capable of sufficiently lowering the height of a system in package or a module including the component built-in substrate, and making the area small and lowering the cost. <P>SOLUTION: This component built-in substrate has a terminal for connecting external components thereto and the terminal is disposed on a lower layer than its uppermost mounting part. A second resin sheet, which forms the lower layer of a surface mounting part for surrounding the exposed part of the terminal, is made of resin having a lower fluidity than that of a first resin sheet for bonding the other layers. <P>COPYRIGHT: (C)2010,JPO&INPIT |
