| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer holding method of sticking a spacer suppressing vibration of the wafer in dicing to an inner peripheral part of a wafer rear surface with an annular protruded part on its outer peripheral part formed by grinding only the inner peripheral part of the wafer rear surface and a level difference formed between an inner peripheral plane and the annular protruded part, and sticking a dicing sheet to the wafer rear surface via the spacer, a method of manufacturing a chip element by the holding method and a space used in the holding method. SOLUTION: The spacer 40 with an adhesive layer 42 is stuck to a region surrounded by the annular protruded part of a semiconductor wafer 11 having a circuit 13 formed on a front surface and the annular protruded part 17 formed on the rear surface outer peripheral part and the dicing sheet 10 is stuck to the semiconductor wafer rear surface via the spacer. COPYRIGHT: (C)2010,JPO&INPIT |
