发明名称 CHEMICAL-MECHANICAL POLISHING LIQUID
摘要 <p>The invention provides a chemical-mechanical polishing liquid. It contains star polymer with a pigment-affinity group, abrasive particles, chelant,oxidant and water. The polishing liquid can reduce the dishing of a polished copper block, and can prevent partial and integral corrosion of metal copper under the case of keeping high copper removal rate by applying the polishing liquid of the invention.</p>
申请公布号 WO2010069149(A1) 申请公布日期 2010.06.24
申请号 WO2009CN01498 申请日期 2009.12.18
申请人 ANJI MICROELECTRONICS (SHANGHAI) CO., LTD;JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN 发明人 JING, JUDY, JIANFEN;CAI, BOJAN, XINYUAN
分类号 C09G1/02 主分类号 C09G1/02
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