发明名称 ELECTRONIC APPARATUS CASE
摘要 <P>PROBLEM TO BE SOLVED: To efficiently radiate heat by integrally forming a metal case with a high temperature conductive resin inner. Ž<P>SOLUTION: A high temperature conductive resin inner 12 is integrally formed in a metal case 11 formed by pressing a plate of an aluminum alloy by insert molding etc. The inner 12 has plate springs 12b and 12c. When a lens unit 21 is attached to a frame 10, an imaging element holding plate 21b comes into contact with the plate spring 12b. As a result, heat generated at an imaging element 21a is transmitted to the plate spring 12b via the imaging element holding plate 21b. When a substrate 22 is attached to the front frame 10, a plate spring 12c comes into contact with an IC 22a. As a result, heat generated at the IC 22a is transmitted to the plate spring 12c. Heat transmitted to the plate springs 12b and 12c is transmitted through the interior of the inner 12 and transmitted to the metal case 11 and heat is radiated from the front surface of the metal case 11 to air. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010141133(A) 申请公布日期 2010.06.24
申请号 JP20080316086 申请日期 2008.12.11
申请人 FUJIFILM CORP 发明人 MAYUMI KAZUYA;NAKAMURA WATARU
分类号 H05K7/20;G03B17/02 主分类号 H05K7/20
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