| 摘要 |
A chemical mechanical polishing system is provided having one more polishing stations (32). The polishing stations (32) include a platen (41) and pad (44) mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area (60) and a recessed area (62). The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate. <IMAGE> <IMAGE> |
