| 摘要 |
PURPOSE: A tape for processing a wafer and a method for fabricating a semiconductor package using the same are provided to offset a compressive stress applied to the wafer by attaching a warpage preventive film including a tensile force to the upper side of the wafer. CONSTITUTION: A tape(102) for processing a wafer includes a film body(101) and a film for preventing warpage(104). The film for preventing warpage is attached on the single side of the film body and made of an expansible foaming film. The film for preventing warpage has a tensile force. The film for preventing warpage is made of an ultra violet reactant film.
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