发明名称 IGBT Having One or More Stacked Zones Formed within a Second Layer of the IGBT
摘要 An IGBT includes a first region, a second region located within the first region, a first contact coupled to the first region, a first layer arranged below the first region, a gate overlying at least a portion of the first region between the second region and the first layer and a second layer formed under the first layer. One or more stacked zones are formed within the second layer. Each one or more stacked zones includes a first zone and a second zone that overlies the first zone. Each first zone is inversely doped with respect to the second layer and each second zone is inversely doped with respect to the first zone. The IGBT further includes a third layer formed under the second layer and a second contact coupled to the third layer.
申请公布号 US2010148215(A1) 申请公布日期 2010.06.17
申请号 US20100702627 申请日期 2010.02.09
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHULZE HANS-JOACHIM;FELSL HANS-PETER
分类号 H01L29/739;H01L21/331 主分类号 H01L29/739
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