发明名称 RESIST MATERIAL AND PATTERN FORMING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist material using an additive of a resist material for immersion lithography which is excellent in water repellency and water slipping property, causes few development defects, and ensures a good resist pattern shape after development, and a pattern forming process using the material. <P>SOLUTION: The resist material includes (A) a polymeric compound having recurring units represented by general formula (1), (B) a polymeric compound having a skeleton derived from lactone ring and/or hydroxyl group and/or maleic anhydride, the polymeric compound becoming soluble in alkaline developer under the action of acid, (C) a compound which generates acid upon exposure to high-energy radiation, and (D) an organic solvent. The resist material has excellent transparency to radiation of wavelength up to 200 nm, enables to tailor various properties in immersion lithography by a choice of the resin structure, and can be produced from readily available and easily handleable raw materials. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010134012(A) 申请公布日期 2010.06.17
申请号 JP20080307213 申请日期 2008.12.02
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 HARADA YUJI;HATAKEYAMA JUN;HASEGAWA KOJI;MAEDA KAZUNORI;KOBAYASHI TOMOHIRO
分类号 G03F7/039;C08F220/22;G03F7/004;G03F7/38;H01L21/027 主分类号 G03F7/039
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