| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinder and a grinding method capable of suppressing the damage of a semiconductor wafer having a projection for reinforcement in the disk-like outer peripheral area while the projection for reinforcement is ground without increasing the size of the device. SOLUTION: The semiconductor wafer W includes a device formation area 62 on the front surface of which a device 61 is formed and the outer peripheral area 63 around the device formation area 62. A recess 65 is formed so that the projection for reinforcement projects from the area of the rear surface corresponding to the outer peripheral area 63 by removing the area of the rear surface corresponding to the device formation area 62. The front surface of the semiconductor wafer W is placed on the sucking and holding surface 34a of a chuck table 34. The grinding surface 54a of a grinding wheel 54 is brought into contact with the inner bottom surface 65a of the recess 65 of the semiconductor wafer W diagonally to the projection 64 for reinforcement so that the gap between the grinding surface 54a and the inner bottom surface 65a of the grinding wheel 54 is increased inward of the recess 65. COPYRIGHT: (C)2010,JPO&INPIT |
