| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder-coat forming material, which can impart excellent connection reliability to a substrate having small electrode-pitches when supplying a solder paste by contact-printing, and to provide a method for manufacturing the solder-coat forming material. Ž<P>SOLUTION: The solder-coat forming material contains a solder powder and a vehicle. The surface of 50-75 mass% of the solder powder is subjected to an oxide film forming treatment. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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