The present invention provides a light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device comprises a plurality of the LED chips 10, one dielectric substrate (sub-mount member) 30 which is made of a dielectric substrate for holding the LED chips. The dielectric substrate 30 is formed with a plurality of supporting platforms which respectively holds the LED chips 10. Each supporting platform is provided with a metal layer 31 which is soldered to the LED chip 10. The supporting platforms are configured to leave a groove 34 between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion 32 made of a material having a solder-wettablity higher than that of the supporting platform.
