发明名称 Device and method for controlling substrate processing apparatus
摘要 Depending on the degree of microfabrication requested for each wafer lot, transfer of wafers is controlled. A substrate processing apparatus includes a plurality of PMs 400 and an LLM 500 and is controlled by an EC 200. The EC 200 includes a selection unit 255 and a transfer control unit 260. The unit 255 selects the PM to which the next wafer is to be transferred, and selects, for each lot, whether the wafers are transferred to the same PM in one-lot units or in one-substrate units depending on the degree of the microfabrication requested for each lot. When the wafer transfer in lot units is selected, the unit 260 sequentially transfers the wafers included in the lot to the selected PM. Otherwise the unit 260 sequentially OR transfers the wafers included in the lot from the selected PM to a different PM one by one.
申请公布号 US7738987(B2) 申请公布日期 2010.06.15
申请号 US20070945539 申请日期 2007.11.27
申请人 TOKYO ELECTRON LIMITED 发明人 NUMAKURA MASAHIRO
分类号 G06F19/00;C23C14/00;C23F1/00;C25B11/00;C25B13/00;G06F7/00;H01L21/306 主分类号 G06F19/00
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