发明名称 |
VORRICHTUNG ZUM ÄTZEN VON WAFERN DURCH EINZELWAFER-VERFAHREN UND VERFAHREN ZUM ÄTZEN VON EINZELNEN WAFERN |
摘要 |
<p>An apparatus for etching a wafer by a single-wafer process comprises a fluid supplying device which feeds an etching fluid on a wafer, and a wafer-chuck for horizontally holding the wafer. The wafer-chuck is equipped with a gas injection device for injecting a gas to the wafer, a first fluid-aspirating device, and a second fluid-aspirating device. The etching fluid supplied on the wafer is spread by a rotation of the wafer. The etching fluid is scattered by a centrifugal force, or flows down over an edge portion of the wafer and is blown-off by the gas injected from the gas injection unit, and is aspirated by the first fluid-aspirating device or the second fluid-aspirating device.</p> |
申请公布号 |
AT468602(T) |
申请公布日期 |
2010.06.15 |
申请号 |
AT20060021737T |
申请日期 |
2006.10.17 |
申请人 |
SUMCO CORPORATION |
发明人 |
KOYATA, SAKAE;HASHII, TOMOHIRO;MURAYAMA, KATSUHIKO;TAKAISHI, KAZUSHIGE;KATOH, TAKEO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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