| 摘要 |
<p>PURPOSE: A ball land, a printed circuit board using the same, and a semiconductor package using the same are provided to prevent the deterioration of the performance of a semiconductor chip by improving degree of freedom in the design of the ball land and a circuit wiring. CONSTITUTION: A ball land includes a first land(108a), a second land, a wiring(110) and an insulating layer(112). The second land is separated from the first land. The wiring is formed to cross the first land and the second land. The insulating layer covers the wiring in a space between the first and second lands and insulates the wiring from the first and second lands.</p> |
