| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which uses a lead free solder containing Bi with highly reliable joining characteristics, and to provide a method of manufacturing the same. SOLUTION: The electronic device includes an electrode provided in an electronic part and a soldering material formed on the surface of the electrode. The soldering material includes the first metal containing at least Bi, an alloy of the second metal and the third metal, and the third metal, wherein the second metal can form an intermetallic compound with Ni. The use of the soldering material can solve the problem of peeling off in the electrode caused after forming a solder bump, and high reliability in joining can be achieved. COPYRIGHT: (C)2010,JPO&INPIT |
