| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate that is formed by laminating a plurality of ceramic layers, includes a hollow part inside, and two or more single conductor layers formed on a bottom surface and a ceiling surface in parallel, and through-holes communicating the hollow part with external, and includes an excellent shape including the conductor layers and excellent dimensional accuracy. SOLUTION: The wiring substrate K1 includes: a substrate body 2 formed by laminating the plurality of ceramic layers s1-s6, and having a front surface 3 and rear surface 4 rectangular in plan view, and four outer wall surfaces 5a, 5b positioned therebetween; the hollow part 6 formed inside the substrate body 2, and formed inside the ceramic layers s2-s4 of intermediate layers out of the ceramic layers s1-s6; the ceiling surface 7 and floor surface 8 of the hollow part 6; the through-holes h1, h2 individually passing through between the front surface 3 and rear surface 4 of the substrate body 2; and two single conductor layers 10, 17 formed on the ceiling surface 7 and floor surface 8 of the hollow part 6 in parallel. The through-holes h1, h2 are opened on the ceiling surface 7 and floor surface 8 of the hollow part 6 in positions except for regions formed with the conductor layers 10, 17. COPYRIGHT: (C)2010,JPO&INPIT |
