| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with high reliability on electric insulation between adjacent wiring conductors without causing electromigration between the wiring conductors. SOLUTION: The method of manufacturing the wiring board includes the steps of: placing a transfer sheet 9, formed by holding a wiring conductor 8 made of gold foil in a peelable state on an adhesive layer 7 bonded to one principal surface of a base film 6 for transfer, such that the wiring conductor 8 comes into contact with a principal surface of an insulating sheet 1 containing an uncured thermosetting resin composition; pressing the transfer sheet 9 against the insulating sheet 1 at a predetermined temperature to bury the wiring conductor 8 in the principal surface of the insulating sheet 1, and then drawing and peeling the base film 6 for transfer from the principal surface of the insulating sheet 1 together with the adhesive layer 7 to transfer the wiring conductor 8 to the principal surface of the insulating sheet 1, the adhesive layer 7 being 0.9 to 1.5 times as thick as the wiring conductor 8. COPYRIGHT: (C)2010,JPO&INPIT
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