发明名称 |
SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA |
摘要 |
Provided is a semiconductor power module package including a bonding area on a direct bonding cupper (DBC) board. The semiconductor power module package includes: one or more semiconductor chips; a sealing member sealing the one or more semiconductor chips; a plurality of leads electrically connected to the one or more semiconductor chips and exposed from the sealing member; and an external bonding member electrically connected to the one or more semiconductor chips and electrically connecting an external circuit board exposed from the sealing member. |
申请公布号 |
US2010140786(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20090632298 |
申请日期 |
2009.12.07 |
申请人 |
FAIRCHILD KOREA SEMICONDUCTOR LTD. |
发明人 |
LEE KEUN-HYUK;KO YOUNG-SUN;LIM SEUNG-WON;JUNG MAN-KYO;CHOI SEUNG-YONG |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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