| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dummy chip which can be produced efficiently, while supplying of the dummy chip is not stopped in a taping process, without causing the nonconformity that stay in a parts feeder occurs due to electrostatic charge. <P>SOLUTION: The dummy chip 11 is packaged by taping with a conductor layer 13, formed on the entire upper and back surfaces of a rectangular insulating substrate 12, having predetermined dimensions L, W and d, and the ceramic substrate will not be exposed due to the existence of the conductor layer and thereby eliminating static electricity from charging; and the dummy chip can be supplied smoothly and produced efficiently. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
