发明名称 BASE WITH BENDABLE WIRE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a base material with a bendable wiring, wherein disconnection of the wiring crossing a bending line is not easily caused even if the base material is bent along the bending line. SOLUTION: In the base material with a wiring, which has the base material having a plurality of regions continuously adjacent to each other through the bending line and the wiring provided so as to cross the bending line and to connect the plurality of the continuously neighboring regions of the base material, the wiring is a bendable wiring having a bent wiring part which reaches the bending line, changes its direction, and extends along the bending line. Electronic components are mounted on the base material with a bendable wiring to form an electronic apparatus. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129904(A) 申请公布日期 2010.06.10
申请号 JP20080305188 申请日期 2008.11.28
申请人 TOPPAN FORMS CO LTD 发明人 KAWAZOME MITSURU
分类号 H05K1/02;H01L23/12 主分类号 H05K1/02
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