| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module capable of sufficiently dissipating heat of a substrate. SOLUTION: The module 1 includes a substrate 2 having an IC 11 and electrode pads 5 and 5, and an inductor L having terminals 8 and 8 electrically connected to the electrode pads 5 and a body L13, and disposed over the side of a top surface 2a of the substrate 2. Further, the module 1 has a heat dissipation pattern 14 brought into contact with the top surface 2a of the substrate 2 and a reverse surface 13b of the body 13 between the substrate 2 and inductor L. The heat of the substrate 2 is therefore positively conducted to the inductor L with high heat conductivity by the heat dissipation pattern 14 and is dissipated by the inductor L. Here, both ends 14a of the heat dissipation pattern 14 project from the inductor L when viewed along a normal to the top surface 2a, so the heat conduction path by the heat dissipation pattern 14 to the inductor L is expanded to make the heat conduction suitable. COPYRIGHT: (C)2010,JPO&INPIT
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