| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module which has an external terminal securely connected to a terminal provided to each circuit, can have the external terminal easily detached from each terminal, and has superior repairability and reliability. SOLUTION: The power semiconductor module includes a circuit board, a power semiconductor power element bonded to a device mounting portion of a wiring pattern of the circuit board, a cylindrical external terminal communication portion bonded to the wiring pattern, a circuit forming means for connecting a part requiring an electric connection, and a transfer mold resin for sealing them. The cylindrical external terminal communication portion is a metal cylinder in a shape of a truncated cone, and is smaller in diameter on a side exposed from the transfer mold resin than on a side bonded to the wiring pattern. COPYRIGHT: (C)2010,JPO&INPIT
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