发明名称 |
DOUBLE-SIDE GRINDING APPARATUS FOR WAFER AND DOUBLE-SIDE GRINDING METHOD |
摘要 |
A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can simultaneously grind either surface of a wafer to be ground by pressing a grindstone against either surface of the wafer to be ground while hydrostatically supporting either surface of the wafer to be ground in a noncontact manner. Each hydrostatic supporting unit is formed with a hydrostatic pad member facing the wafer to be ground, and a base member placed on the back surface of the hydrostatic pad member. The hydrostatic pad member is made of a ceramic member, and the base member is made of a metal member.
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申请公布号 |
US2010144248(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20090607265 |
申请日期 |
2009.10.28 |
申请人 |
SUMCO TECHXIV CORPORATION |
发明人 |
FUTAMURA HIROYASU |
分类号 |
B24B7/17;B24B1/00;B24B41/06;B24B55/02 |
主分类号 |
B24B7/17 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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