发明名称 Method of fabricating heat dissipating apparatus
摘要 The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.
申请公布号 US7730605(B2) 申请公布日期 2010.06.08
申请号 US20070785326 申请日期 2007.04.17
申请人 发明人 YEH LAN-KAI;LIN CHE-WEI;TSAI MING-JYE;CHEN SHAO-WEN;SHYU JIN-CHERNG
分类号 H05B3/00 主分类号 H05B3/00
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