发明名称 CERAMIC ELECTRONIC COMPONENT AND COMPONENT BUILT-IN SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a ceramic electronic component suitable for a component built-in substrate, and a highly reliable component built-in substrate using the ceramic electronic component. <P>SOLUTION: The ceramic electronic component 10 is so configured that its external terminal electrodes are covered by a resin layer 7 composed of a ceramic element 1 and a pair of external terminal electrodes 5a, 5b formed on an outer surface of the ceramic element and containing inorganic fillers. In the component built-in substrate, an insulating material 20a constituting a portion adjacent to the ceramic electronic component 10 in a substrate body 21 contains a first resin and the first inorganic filler, the external edge electrodes installed in the ceramic electronic component 10 are covered by the resin layer 7, a material containing a second resin is used for the resin layer 7 and the second resin is the same as the first resin. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010123865(A) 申请公布日期 2010.06.03
申请号 JP20080298123 申请日期 2008.11.21
申请人 MURATA MFG CO LTD 发明人 OTA YUTAKA;KOGA SEISHI
分类号 H01G4/30;H01G4/12;H05K3/46 主分类号 H01G4/30
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