| 摘要 |
PROBLEM TO BE SOLVED: To achieve a buildup wiring board having characteristics excellent against a heat shock and suitable for via connection reliability and highly dense wiring. SOLUTION: The printed wiring board includes a structure in which a core board 14 includes a wiring pattern 18 formed by removing at least a part of a region having a first via 13 formed thereon, a buildup layer 17 includes a second via 16 in which a metal layer 15 is filled in another via hole formed in at least a region immediately above the first via 13 of the core board 14 by plating, the metal layer 15 in the second via 16 is provided on a conductive paste 12 in the first via 13 in the core board 14, and the metal layer 15 in the second via 16 and the conductive paste 12 in the first via 13 are formed so as to have a region in which they directly contact each other without interposing a resin. COPYRIGHT: (C)2010,JPO&INPIT |
