Process kits for use in a semiconductor process chambers have been provided herein. In some embodiments, a process kit for a semiconductor process chamber includes a body configured to rest about a periphery of a substrate support and having sidewalls defining an opening corresponding to a central region of the substrate support. A lip extends from the sidewalls of the body into the opening, wherein a portion of an upper surface of the lip is configured to be disposed beneath a substrate during processing. A first distance measured between opposing sidewalls of the body is greater than a width across the upper surface of a substrate to be disposed within the opening by at least about 7.87 mm.
申请公布号
WO2010062579(A2)
申请公布日期
2010.06.03
申请号
WO2009US62166
申请日期
2009.10.27
申请人
APPLIED MATERIALS, INC.;KIM, JONG MUN;ZHAO, XIAOYE;KENNEY, JASON ANDREW;RAUF, SHAHID
发明人
KIM, JONG MUN;ZHAO, XIAOYE;KENNEY, JASON ANDREW;RAUF, SHAHID