| 发明名称 |
STACKING QUAD PRE-MOLDED COMPONENT PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME |
| 摘要 |
Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads. |
| 申请公布号 |
WO2010033322(A3) |
申请公布日期 |
2010.06.03 |
| 申请号 |
WO2009US53597 |
申请日期 |
2009.08.12 |
| 申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION;LIU, YONG;ALLEN, HOWARD;QIAN, QIUXIAO |
发明人 |
LIU, YONG;ALLEN, HOWARD;QIAN, QIUXIAO |
| 分类号 |
H01L23/12;H01L23/495 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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