| 发明名称 |
WHISKER-FREE COATING STRUCTURE AND METHOD OF FABRICATING THE SAME |
| 摘要 |
A whisker-free coating structure and a method for fabricating the same are disclosed. The whisker-free coating structure includes a substrate, a tungsten doped copper layer overlaying the substrate, and a lead-free tin layer overlaying the tungsten doped copper layer.
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| 申请公布号 |
US2010132978(A1) |
申请公布日期 |
2010.06.03 |
| 申请号 |
US20090471162 |
申请日期 |
2009.05.22 |
| 申请人 |
NATIONAL TAIWAN UNIVERSITY OF SCIENCE & TECHNOLOGY |
发明人 |
YEN YEE-WEN;CHU JINN P.;LIN CHON-HSIN;HSU CHUN-LEI;LI CHAO-KANG |
| 分类号 |
H01B5/00;C23C14/35;C25D5/00 |
主分类号 |
H01B5/00 |
| 代理机构 |
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