| 摘要 |
A honeycomb filter 1, which comprises an integral structure of a plurality of honeycomb segments 12 bonded by an adhesive 8. The honeycomb segment has numbers of through-holes 3, which are surrounded by partition walls 2 and extend in the axial direction of the segment. The honeycomb filter is characterized in that a ratio of a thermal conductivity kappa s of the honeycomb segment 12 to a thermal conductivity kappa a of the adhesive 8 , kappa s/kappa a, is in a range of 5 to 300 and a density rho a of the adhesive 8 is in a range of 0.1 to 4 g/cc. The honeycomb filter can prevent excessive temperature increase, can be low in non-uniformity of temperature distribution, and can be superior in durability. |
