| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for decreasing the impedance of a shield section, and for reducing noise by connecting the shield section to a ground with multiple points, and for verifying even the connection failure of a shield film (shield) before the semiconductor device is mounted. SOLUTION: The ground of a shield film 3 is not grounded to a ground layer 21 of an interposer substrate 2. Concretely, a through-hole 32 for shield film connection is installed at the corresponding place of the ground layer, and a pin 8 for connection is put through this so that it is possible to separate a circuit element 1 from the ground of the shield film 3, and to easily discriminate the problem of disconnection or the like. COPYRIGHT: (C)2010,JPO&INPIT |
