METHOD AND DEVICE FOR FACILITATING SEPARATION OF SLICED WAFERS
摘要
<p>An apparatus for separating a front wafer from a stack of wafers with internal gaps between the wafers is disclosed. The apparatus includes a chuck for gripping the front wafer, coupled to a mechanical arm and a drive for moving the arm to bring the chuck to the front wafer and to separate the wafer from the stack of wafers. Further included is a heater for heating the front wafer so as to raise the temperature within the internal gap between the front wafer and the adjacent wafer of the stack of wafers above the temperature of more distant internal gaps within the stack.</p>
