发明名称 MANUFACTURING METHOD OF THIN-FILM ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a thin-film element capable of simplifying the whole process and minimizing the change of characteristics of the thin-film element in a transfer process. <P>SOLUTION: The manufacturing method of the thin-film element includes a stage for forming a sacrificing layer on a first substrate, a stage for forming a thin-film laminate on the sacrificing layer, a stage for forming separating grooves for exposing the sacrificing layer to split the thin-film laminate into at least one thin-film element, a stage for removing the sacrificing layer partially utilizing a dry etching process, (in this stage, at least one thin-film element is maintained on the first substrate in a remaining sacrificing layer region.), a stage for temporary connecting a supporting structure to the at least one thin-film element, a stage for separating at least one thin-film element connected to the supporting structure from the first substrate (in this stage, the remaining sacrificing layer region is removed.), a stage for connecting at least one thin-film element connected to the supporting structure to a second substrate, and a stage for separating the supporting structure from at least one thin-film element. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010118638(A) 申请公布日期 2010.05.27
申请号 JP20090143737 申请日期 2009.06.16
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM SANG JIN;OH YONGSOO;LEE HWAN-SOO
分类号 H01L21/02;H01L27/12 主分类号 H01L21/02
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