| 摘要 |
<p>Described is a gyroscope with a vibrating structure, produced by micromachining in a thin wafer, which comprises a movable inertial assembly comprising at least one movable mass able to vibrate in the plane of the wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb and an interdigital drive comb. It furthermore comprises at least one additional interdigital comb, called the quadrature-error compensation comb, connected to the mass and which has two asymmetric air gaps e andλe,λbeing a positive real number, for subjecting the mass to an adjustable electrostatic stiffness due to coupling between the x-axis and the y-axis by applying a variable DC voltage V to this comb, the adjustable stiffness allowing compensation for the quadrature error of the gyroscope.</p> |
