| 摘要 |
<P>PROBLEM TO BE SOLVED: To supply method/device of silicon wafer abrasive with which classification is performed from abrasive where distribution width of a grain size is wide with a simple method and abrasive after classification can efficiently be supplied to the wrapping process of a wafer. Ž<P>SOLUTION: Dispersion solution and abrasive are supplied to a separation tank 2, and they are stirred and mixed. Abrasive dispersed in dispersion solution is settled while stirring speed is controlled. Settled abrasive is extracted with dispersion solution from a plurality of liquid take-out ports 14a, 14b and 14c arranged by leaving intervals along a depthwise direction of the separation tank 2, and it is set to be classified slurry. Classified slurry is supplied to the wrapping process of the silicon wafer. Ž<P>COPYRIGHT: (C)2006,JPO&NCIPI Ž |
