SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

摘要

A semiconductor element, wherein copper transition layers (38) disposed on die pads (22) of an IC chip (20) are incorporated in a multi-layer printed circuit board (10), whereby the IC chip (20) can be connected electrically to the multi-layer printed circuit board (10) without using lead parts and sealing resin, the resin is prevented from remaining on an aluminum pad (24) by providing the copper transition layers (38) on the aluminum pad (24), and the connectability between the die pads (22) and via holes (60) and the reliability thereof can be increased.