发明名称 |
APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID |
摘要 |
Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate. |
申请公布号 |
WO2010039409(A3) |
申请公布日期 |
2010.05.20 |
申请号 |
WO2009US56679 |
申请日期 |
2009.09.11 |
申请人 |
APPLIED MATERIALS, INC.;CHEN, HUI;D'AMBRA, ALLEN L. |
发明人 |
CHEN, HUI;D'AMBRA, ALLEN L. |
分类号 |
H01L21/304;H01L21/302 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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