| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board loaded with a THD that has sure solder connection reliability even with respect to loading of a THD with a large heat capacity or mounting using lead-free solder, and to provide a method of manufacturing the same. Ž<P>SOLUTION: The circuit board 40a loaded with a through-hole mount device (THD) is configured such that a lead 11, being an external terminal of an electronic component 10, is penetratingly inserted into a through-hole 41 provided in a circuit board 40 while being solder-connected to a through-hole conductive layer 42 formed from the side face of the through-hole 41 to the upper/lower surfaces of the circuit board 40. The circuit board 40a loaded with a THD is also configured such that a via-hole 43 penetrating through the circuit board 40 is provided adjacently to the through-hole 41 while a via-hole conductive layer 44, formed from the side face of the via-hole 43 to the upper surface of the circuit board 40 is connected to the through-hole conductive layer 42 on the upper surface of the circuit board 40. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
