| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide precursor solution composition in which adjustment of viscosity of a solution is easy, the viscosity of the solution is stable, and a polyimide resin molded article such as a polyimide film having an excellent physical property equal or more to a linear polyimide can be preferably obtained by heat treatment at a relatively low temperature or in a short time. SOLUTION: The polyimide precursor solution composition comprises at least (A) polyamic acid, (B) a carboxylic acid compound having three or more pairs of carboxyl groups in the molecule or its esterified product, (C) a carboxylic acid compound having two pairs of carboxyl groups in the molecule or its esterified product, and (D) a solvent. COPYRIGHT: (C)2010,JPO&INPIT |
