| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor memory card with an increased number of memory elements mounted on a wiring board while assuring the connection between the wiring board and the memory elements with the increased number of electrodes. <P>SOLUTION: The semiconductor memory card 1 includes a wiring board 2 having a first pad region 10A along a first long side 5A and a second pad region 10B along a second long side 5B. On the wiring board 2, first memory elements 11 for constituting a first element group 13 are stacked stepwise. On the first element group 13, second memory elements 12 for constituting a second element group 14 are stacked stepwise toward the reverse direction. The electrode pad 16 of the first memory element 11 is connected to a connection pad 9 arranged in the first pad region 10A. The electrode pad 19 of the second memory element 12 is connected to the connection pad 9 arranged in the second pad region 10B. <P>COPYRIGHT: (C)2010,JPO&INPIT |
