| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which excels in the compatibility of each component, in which viscosity of the composition is reduced, the physical properties of a cured product obtained can be raised, and which can be used also for an application demanding severe colorless and transparent properties of sealing an optical semiconductor or the like. Ž<P>SOLUTION: The thermosetting resin composition includes the following component (A) and component (B), and the mass ratio of both components, component (A)/component (B) is 20/80-80/20. The component (A) is a polysiloxane derivative which has two or more carboxyl groups and in which more than 10 mol% of a carboxyl group in a carboxyl group-containing polysiloxane of a specific conformation having a siloxane bond is blocked by reaction with a vinyl ether compound. The component (B) is an alicyclic ring type epoxy group containing a basket type silsesquioxane which has two or more alicyclic ring type epoxy groups and has a specific conformation having a cyclohexane ring and a siloxane bond. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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